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Application：

Through the change of chemical potential of copper ion, Sn2+ in plating solution is in replacement reaction with copper surface of PCB to generate silver white tin layer with thickness of about 1μm on copper surface; it is the most ideal process to substitute tin spraying. Immersion tin applies to fine-circuit and dense-circuit PCB as well as Press-fit plug-in technique, and is suitable for lead-free SMT, and meets the requirements for multiple welding. The process applies to horizontal and vertical line.

Advantage introduction：